Camera module

ABSTRACT

Exemplary embodiments of a camera module are proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor, an IRCF (Infrared Cut Filter) installed at an upper surface of the base, and an adhesive member fixing the IRCF to the base.

Pursuant to 35 U.S.C. §119 (a), this application claims the benefit ofearlier filing dates and rights of priorities to Korean PatentApplication Nos. 10-2011-0123090, filed on Nov. 23, 2011,10-2011-0125610, filed on Nov. 29, 2011, and 10-2011-0125612, contentsof which are hereby incorporated by reference in their entirety.

BACKGROUND OF THE DISCLOSURE

1. Field of the Disclosure

The teachings in accordance with exemplary embodiments of the presentdisclosure generally relate generally to a camera module.

2. Discussion of the Related Art

This section provides background information related to the presentdisclosure which is not necessarily prior art.

Generally, an auto focusing adjustment of a camera module is realized bylens control using a VCM (Voice Coil Motor). A camera module formed witha VCM performs a reciprocating operation of a bobbin relative to animage sensor in response to an interaction between a coil wound on aperiphery of the bobbin and a yoke to control a focus of an imageincident on the camera module.

Meanwhile, unlike the eyes of a human, the image sensor can detect lightof all wavelength bands, such that there is a need of interrupting lightof IR (Infrared) wavelength band in order to recognize an image only ina visible light region. To this end, an IR interruption filter isinterposed between the image sensor and the lens. However, a cameramodule includes therein many factors capable of generating foreignobjects, and foreign objects may drop on an upper surface of the imagesensor to disadvantageously generate a black spot or stain phenomenon,thereby causing defects in the image captured by the camera module, orcausing the image appear as a black spot or stain.

SUMMARY OF THE DISCLOSURE

This section provides a general summary of the disclosure, and is not acomprehensive disclosure of its full scope or all of its features.

Exemplary aspects of the present disclosure are to substantially solveat least the above problems and/or disadvantages and to provide at leastthe advantages below. Accordingly, an aspect of the present disclosureprovides a camera module improved in structure mounting a UV(Ultraviolet) cut filter on a base. Another aspect of the presentdisclosure provides a camera module having an image sensor reduced ingeneration of a black spot-oriented defect caused by foreign objects.

It should be emphasized, however, that the present disclosure is notlimited to a particular disclosure, as explained above. It should beunderstood that other technical subjects not mentioned herein may beappreciated by those skilled in the art.

In one general aspect of the present disclosure, there is provided acamera module, the camera module comprising: a PCB (Printed CircuitBoard) mounted with an image sensor; a base installed at an uppersurface of the PCB and formed with a window at a position correspondingto that of the image sensor; an IRCF (Infrared Cut Filter) installed atan upper surface of the base; and an adhesive member fixing the IRCF tothe base.

Preferably, but not necessarily, the adhesive agent may include anadhesive section adhering the IRCF to the base, and a foreign objectcollection section free from contact with the IRCF.

Preferably, but not necessarily, the adhesive agent may be attached to asurface of a periphery of the window opposite to the IRCF, and may bearranged to be spaced apart from the periphery of the window atpredetermined distance, and having a predetermined width.

Preferably, but not necessarily, the IRCF may be formed to have an areagreater than that of the window, and the adhesive agent may be attachedto a surface of a periphery of the window opposite to the IRCF to havean area greater than a contact area between the IRCF and the base.

Preferably, but not necessarily, the adhesive agent may be adhesivelyfixed to a concave groove of the base so formed as to have a depthcorresponding to a thickness of the adhesive agent.

Preferably, but not necessarily, the adhesive agent may be adhesivelyfixed to a concave groove of the base so formed as to have a depthdeeper than a depth corresponding to a thickness of the adhesive agent.

Preferably, but not necessarily, the adhesive agent may be provided inany one of a double-sided tape and an epoxy.

Preferably, but not necessarily, the adhesive agent may be fixedlyarranged on an upper surface of the base.

Preferably, but not necessarily, the adhesive agent may be adhesivelyfixed to a concave groove of the base so formed as to have a depthdeeper than a depth corresponding to a thickness of the adhesive agent,and the concave groove may be connected to an upper surface of the basethrough a slope to guide foreign objects at the upper surface of thebase to the adhesive agent.

Preferably, but not necessarily, the camera module may further comprise:a bobbin including a coil winding unit vertically and reciprocallymovable on the upper surface of the base and provided at a periphery,and a plurality of rib members protrusively formed on a floor surface;and a yoke mounted with a magnet arranged at a position corresponding tothat of a coil of the bobbin.

Preferably, but not necessarily, the yoke may be provided with a shieldcan of metal material having an EMI (Electromagnetic Interference)function to form an extreme outer shell of the camera module, and theyoke may further include a housing member formed in a resin material,and provided at an outer surface thereof with a shield can of metalmaterial having the EMI function.

Preferably, but not necessarily, the outer surface of the yoke may forman extreme outer shell of the camera module, and a balance surface ofthe yoke integrally forms the housing member to allow being on a samesurface as the outer surface of the yoke.

In another general aspect of the present disclosure, there is provided acamera module, the camera module comprising: one or more sheets oflenses receiving an optical image of an object; an image sensorconverting the optical image of the object from a lens to an electricalsignal, formed at an upper surface with a dam, and formed at an uppermarginal area of the image sensor with a dust trap from the dam; and asubstrate mounted with the image sensor.

Preferably, but not necessarily, the dam may be provided with a shape ofa ring.

Preferably, but not necessarily, the dam may be formed at a periphery ofan active region.

Preferably, but not necessarily, the dam may be formed at a positionspaced apart from the active region.

Preferably, but not necessarily, the dust trap may be further formed toan upper surface of the substrate not mounted with the image sensor.

Preferably, but not necessarily, the dust trap may be provided in anepoxy or an adhesive agent.

Preferably, but not necessarily, the dust trap may be further formed ata lateral surface of the image sensor.

Preferably, but not necessarily, the dam may be a curable epoxy.

Preferably, but not necessarily, the dam may be formed at an uppersurface of the image sensor using a separate dam member using anadhesive material.

Preferably, but not necessarily, the camera module may further comprise:a lens barrel embedded with the lens; an actuator moving the lensbarrel; and a holder supporting the lens barrel and the actuator andattached to the substrate.

Preferably, but not necessarily, the actuator may include one of a VCM(Voice Coil Motor) actuator, an actuator driven by a piezoelectric forceand a MEMS (Micro Electro Mechanical System) actuator driven byelectrostatic capacity method.

Preferably, but not necessarily, the holder may be formed with a windowpassing an optical image incident on the lens, and an IR (Infrared CutFilter) is interposed between the window and the image sensor.

Preferably, but not necessarily, the holder may be formed with a windowpassing an optical image incident on the lens, and an IRCF (Infrared CutFilter) is interposed between the window and the lens.

The IRCF may be attached/fixed using an adhesive agent attached to thebase, and a balance adhesive surface may be used for a dust trap forcollecting foreign objects, whereby fine minute particles generatedinside the camera module can be minimized in polluting the IRCF.

The present disclosure has an advantageous effect in that a dam isformed at an upper surface of an image sensor, and a dust trap is formedat an upper surface of the image sensor at a periphery of the dam tothereby trap more foreign objects dropping from the image sensor, andthe image sensor is reduced in being generated with black spot defectscaused by the foreign objects.

The present disclosure has a further advantageous effect in that a damis formed at an upper surface of an image sensor, whereby the formeddust trap can prevent an active region of the image sensor from beingpolluted.

The present disclosure has a still further advantageous effect in that adust trap can be formed at an upper surface of the image sensor at aperiphery of the dam, at a lateral surface of the image sensor and at anupper surface of a substrate to form an increased area of dust trapabout the image sensor, whereby most of the foreign objects moving atthe upper surface of the image sensor can be trapped and the foreignobjects are prevented from dropping to the active region.

Other exemplary aspects, advantages, and salient features of thedisclosure will become more apparent to persons of ordinary skill in theart from the following detailed description, which, taken in conjunctionwith the annexed drawings, discloses exemplary embodiments of theinvention.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings, which are included to provide a furtherunderstanding of the disclosure and are incorporated in and constitute apart of this application, illustrate embodiment(s) of the disclosure andtogether with the description serve to explain the principle of thedisclosure. In the drawings:

FIG. 1 is a cross-sectional view illustrating a schematic structure of acamera module according to a first exemplary embodiment of the presentdisclosure;

FIG. 2 is a cross-sectional view illustrating a schematic structure of acamera module according to a second exemplary embodiment of the presentdisclosure;

FIG. 3 is a plan view illustrating a base of FIG. 1;

FIGS. 4 and 5 are cross-sectional views illustrating a schematicstructure of a camera module according to a third exemplary embodimentof the present disclosure;

FIG. 6 is a cross-sectional view illustrating a schematic structure of acamera module according to a fourth exemplary embodiment of the presentdisclosure;

FIG. 7 is an enlarged view of ‘A’ of FIG. 6;

FIG. 8 is a schematic bottom perspective view illustrating a base coatedwith a dust trap of FIG. 6;

FIG. 9 is a cross-sectional view illustrating a schematic structure of acamera module according to a fifth exemplary embodiment of the presentdisclosure;

FIG. 10 is a plan view of a substrate of FIG. 9;

FIG. 11 is a cross-sectional view illustrating a schematic structure ofa camera module according to a sixth exemplary embodiment of the presentdisclosure;

FIG. 12 is a plan view of a substrate of FIG. 11;

FIG. 13 is a cross-sectional view illustrating a schematic structure ofa camera module according to a seventh exemplary embodiment of thepresent disclosure;

FIG. 14 is a cross-sectional view illustrating a schematic structure ofa camera module according to an exemplary embodiment of the presentdisclosure; and

FIG. 15 is a partial cross-sectional view illustrating a schematicstructure of a camera module according to an exemplary embodiment of thepresent disclosure.

Additional advantages, objects, and features of the disclosure will beset forth in part in the description which follows and in part willbecome apparent to those having ordinary skill in the art uponexamination of the following or may be learned from practice of thedisclosure. The objectives and other advantages of the disclosure may berealized and attained by the structure particularly pointed out in thewritten description and claims hereof as well as the appended drawings.

It is to be understood that both the foregoing general description andthe following detailed description of the present disclosure areexemplary and explanatory and are intended to provide furtherexplanation of the disclosure as claimed.

DETAILED DESCRIPTION

Hereinafter, exemplary embodiments of the present disclosure will bedescribed in detail with reference to the accompanying drawings.

In describing the present disclosure, detailed descriptions ofconstructions or processes known in the art may be omitted to avoidobscuring appreciation of the invention by a person of ordinary skill inthe art with unnecessary detail regarding such known constructions andfunctions. Accordingly, the meaning of specific terms or words used inthe specification and claims should not be limited to the literal orcommonly employed sense, but should be construed or may be different inaccordance with the intention of a user or an operator and customaryusages. Therefore, the definition of the specific terms or words shouldbe based on the contents across the specification.

FIG. 1 is a cross-sectional view illustrating a schematic structure of acamera module according to a first exemplary embodiment of the presentdisclosure, FIG. 2 is a cross-sectional view illustrating a schematicstructure of a camera module according to a second exemplary embodimentof the present disclosure, FIG. 3 is a plan view illustrating a base ofFIG. 1, and FIGS. 4 and 5 are cross-sectional views illustrating aschematic structure of a camera module according to a third exemplaryembodiment of the present disclosure.

Referring to FIGS. 1 to 4, the camera module according to an exemplaryembodiment of the present disclosure includes a PCB (10), a base (20), abobbin (30), a yoke (40), a bottom spring (50), an upper spring (60), acover member (70) and a shield can (80).

The PCB (10) is mounted at an upper surface with an image sensor (11),and the image sensor (11) is installed at an upper surface with the base(20).

The base (20) is centrally formed at a position corresponding to aposition of the image sensor (11) with a though hole passing a window(22), and an image can be transmitted to the image sensor (11) throughthe window (22). The window (22) is installed with an IRCF (21), detailsof which will be provided later.

The bobbin (30) is liftably formed at an upper surface of the base (20),and is protrusively formed at a floor surface with a plurality of ribmembers (31) to surface-contact the base (20) at an initial position.

The bobbin (30) is wound at a periphery thereof with a coil (32), and ina case a current flows in the coil (32), a magnetic field is formed atthe bobbin (30), whereby a reciprocative movement is performed inresponse to interaction with a magnet (41) mounted on the yoke (40).

The yoke (40) is arranged at an upper surface of the base (20), and theyoke (40) is movably formed at an inner surface with the bobbin (30)mounted with the lens (32) to a vertical direction (‘A’ arrow direction)of FIG. 1. The yoke (40) is formed at the inner surface with a magnet(41) in opposition to the bobbin (40) wound with the coil (32).

The bottom spring (50) is interposed between the yoke (40) and the base(20), and is so configured as to support a floor surface of the bobbin(30), whereby the vertical movement of the bobbin (30) is elasticallysupported. The bottom spring (50) is connected with a start line and anend line of the coil (32) wound on the periphery of the bobbin (30),where the coil (32) is electrically connected to the PCB (10) throughthe bottom spring (50).

Although not illustrated in the drawings, a spacer may be interposedbetween the yoke (40) and the bottom spring (50). The spacer isinstalled to insulate the bottom spring (50) from the yoke (40), whereit would be possible to the base (20) instead of the spacer by changinga shape of the base (20).

The cover member (70) is coupled to an upper surface of the yoke (40).The cover member (70) is centrally formed with an opening with a sizecorresponding to that of the lens (33) in order to allow an outsideimage to be transmitted to the image sensor (11) through the lens (33).

Meanwhile, the cover member (70) may be omitted, depending oncircumstances, or only a lateral portion arranged at an upper surface ofthe cover member (70) may be provided, where a boss (not shown)protrusively formed at an upper surface of the cover member (70) isformed and the upper spring (60) is fixed using the boss.

The shield can (8) is configured to wrap an outer shell of theabove-mentioned constituent elements, where a lens hole equal to in sizeor greater than the through hole is formed at a position correspondingto the through hole to allow the outside image to be transmitted to theimage sensor (11) through the through hole.

Meanwhile, although not illustrated in the drawings, it is possible toform a housing member to wrap the yoke (40) forming an outer shell ofthe camera module. In this case, the housing member is centrallyarranged with a lens hole the size of the lens (33) to allow the outsideimage to be transmitted to the image sensor (11) through the lens (33)arranged at an inner surface of the bobbin (30).

Furthermore, the housing member is preferably provided with a metalmaterial to perform an EMI function. However, the present disclosure isnot limited thereto, and it is possible to form an extreme outer shellof the camera module with resin material, or other metal material.

Furthermore, the housing member and the yoke (40) may be integrallyformed instead of using a separate housing member. That is, in order toreduce the size of the camera module, a housing member wrapping the yoke(40) is dispensed with, and an outer surface of the yoke (40) may beexposed while the housing member may be formed with only the balancedportion for integration to allow on the same surface as the outersurface of the yoke (40).

Referring to FIGS. 1 and 2, the IRCF (21) is fixed to the base (20)using an adhesive agent (100). The adhesive agent (100) may be adouble-sided tape, or any adhesive means including an adhesive andepoxy.

If a separate curing process is to be added, an UV (Ultraviolet) epoxyor thermosetting epoxy that requires UV treatment or thermosettingprocess may be used.

The adhesive agent (100) is arranged at a periphery of the window (22)with a predetermined width (w) as shown in FIG. 3, where the width (w)may be formed greater than a contact area between the IRCF (21) and thebase (2). Thus, as illustrated in FIG. 3, the adhesive agent (100) maybe divided to an adhesive section (110) adhering the IRCF (21) to thebase (20), and a foreign object collection section (120) not contactingthe IRCF (21). At this time, an area of the adhesive section (110) ispreferably formed larger than an area of the foreign object collectionsection (120).

The adhesive agent (100) is arranged at an upper surface of the base(20), and is preferably interposed between the IRCF (21) and the base(20). The adhesive agent (100) may be directly attached to the uppersurface of the base (20), or a groove having a height corresponding to athickness of the adhesive agent (100) may be formed on the upper surfaceof the base (20), to which the adhesive agent (100) may be attached asshown in FIGS. 1 and 2.

Referring to FIG. 2 again, the adhesive agent (100) may be arranged in astate of being spaced apart from the periphery of the window (22) at apredetermined distance (g). Ideally, the adhesive agent (100) is closelyarranged at the periphery of the window (22). However, in considerationof the need for an arrangement error that occurs in the arrangingprocess of the adhesive agent (100), the adhesive agent (100) isarranged with an allowance of a predetermined distance (g) from theperiphery of the window (22).

According to the second exemplary embodiment of the present disclosureas illustrated in FIG. 4, a groove having a depth greater than athickness of the adhesive agent (100) is formed at the upper surface ofthe base (20), and the adhesive agent (100) may be arranged inside thegroove. In this case, a staircase-like portion may be provided at thegroove accommodated by the upper surface of the base (20) and theadhesive agent (100).

Alternatively, as shown in FIG. 5, the staircase portion is providedwith a slope (23), and pollutants such as fine minute particles insidethe camera module may be induced to the adhesive agent (100) sidethrough the slope (23).

According to the third exemplary embodiment of the present disclosure, adust trap resin (100) may be coated on a surface facing the image sensor(11) of the base (20) mounted with the IRCF (21), and in order tofacilitate the coating of the dust trap resin (100), a dust trap resincut rib (23) may be formed at an ambience of the window (22).

Furthermore, the IRCF (21) may be formed on an opposite surface of asurface facing the image sensor (11) of the base (20). That is,referring to FIGS. 1 to 3, the IRCF (21) is arranged at the window (22)penetratively formed at the base (20), where an arranged portion of theIRCF (21) at the window (22) is protrusively formed with the dust trapresin cut rib (23) at a predetermined height towards the image sensor(11).

At this time, a surface facing the PCB (10) is coated with the dust trapresin (100) at a predetermined thickness, where the dust trap resin(100) may be coated on an inner surface of the dust trap resin cut rib(23) and a lateral wall surface of the PCB (10) as shown in FIG. 2.Furthermore, it may be possible to coat the dust trap resin (100) on anyone of the an inner surface of the dust trap resin cut rib (23) and thelateral wall surface of the PCB (10).

At this time, the dust trap resin cut rib (23) is preferably formed witha chamfer (24), where the chamfer (24) is to avoid interference with awire-bonded portion, in a case the base (20) is mounted on the PCB (10).In addition, the dust trap resin cut rib (23) is preferably formed at anupper surface of a non-image area of the image sensor (11) to avoid acontact with the image sensor (11). The dust trap resin cut rib (23) maybe arranged at an upper surface of a position spaced apart from an imagearea of the image sensor at a predetermined distance.

FIG. 6 is a cross-sectional view illustrating a schematic structure of acamera module according to a fourth exemplary embodiment of the presentdisclosure and FIG. 7 is an enlarged view of ‘A’ of FIG. 6.

Referring to FIGS. 6 and 7, the camera module according to the exemplaryembodiment of the present disclosure includes a PCB (10), a base (20), abobbin (30), a yoke (40), a bottom spring (50), an upper spring (60), acover member (70) and a shield can (80), the configuration of which issame as that of the previous exemplary embodiment.

However, according to the fourth exemplary embodiment of the presentdisclosure, the dust trap resin (100) may be coated on a surface facingthe image sensor (11) of the base (20) mounted with the IRCF (21), andin order to facilitate the coating of the dust trap resin (100), a dusttrap resin cut rib (23) may be formed at an ambience of the window (22).Furthermore, the IRCF (21) may be formed at the opposite surface of asurface facing the image sensor (11) of the base (20).

That is, referring to FIGS. 6, 7 and 8, the IRCF (21) is mounted at thewindow (22) penetratively formed at the base (20), where the mountedarea of the IRCF (21) at the window (22) is protrusively formed with thedust trap resin cut rib (23) at a predetermined height towards the imagesensor (11). At this time, a surface facing the PCB (10) of the base(20) is coated with the dust trap resin (100) at a predetermined height,and at this time, as illustrated in FIG. 7, the dust trap resin (100)may be coated onto an inner surface of the dust trap resin cut rib (23)and the lateral wall surface of the PCB (10).

Furthermore, it may be possible to coat the dust trap resin (100) on anyone of the an inner surface of the dust trap resin cut rib (23) and thelateral wall surface of the PCB (10).

At this time, the dust trap resin cut rib (23) is preferably formed witha chamfer (24), where the chamfer (24) is to avoid interference with awire-bonded portion, in a case the base (20) is mounted on the PCB (10).In addition, the dust trap resin cut rib (23) is preferably formed at anupper surface of a non-image area of the image sensor (11) to avoid acontact with the image sensor (11). The dust trap resin cut rib (23) maybe arranged at an upper surface of a position spaced apart from an imagearea of the image sensor at a predetermined distance.

According to the configuration thus described, the dust trap resin cutrib (23) of a predetermined height is formed at a periphery of the IRCF(21) of a direction facing the image sensor (11) of the base (20)contacting a floor surface of the bobbin (30) of auto focusing unitformed with a VCM, whereby the dust trap resin (100) is prevented fromoverflowing to pollute the IRCF (21) in a case the dust trap resin (100)is coated.

Furthermore, the coating of the dust trap resin (100) on the dust trapresin cut rib (23) and the floor surface and lateral wall surface of thebase (20) can reduce the black spot defect of the camera module that maybe generated by the movable foreign objects being transmitted to theimage sensor (11) side during the mounting process of the base (20) tothe PCB or reliability test.

According to the configuration thus described in FIGS. 1 and 2 again, apart of the adhesive agent (100) adheres the IRCF (21) to the base, anda balance of the adhesive agent (100) not contacting the IRCF (21)performs the dust trap function to collect fine dust or particles insidethe camera module.

In addition, free from a separate adhesive coating and a curing process,a simple operation of placing the IRCF (21) on a precise position wherethe adhesive agent (100) is attached to the base (20) can finish thefixation of the IRCF (21) to simplify a camera module manufacturingprocess and to reduce the manufacturing cost.

Furthermore, because the dust trap resin cut rib (23) of a predeterminedheight is formed at a periphery of the IRCF (21) of a direction facingthe image sensor (11) of the base (20) contacting a floor surface of thebobbin (30) of auto focusing unit formed with a VCM, the dust trap resin(100) is prevented from overflowing to pollute the IRCF (21), in a casethe dust trap resin (100) is coated.

Still furthermore, the coating of the dust trap resin (100) on the dusttrap resin cut rib (23) and the floor surface and lateral wall surfaceof the base (20) can reduce the black spot defect of the camera modulethat may be generated by the movable foreign objects being transmittedto the image sensor (11) side during the mounting process of the base(20) to the PCB or reliability test.

FIG. 9 is a cross-sectional view illustrating a schematic structure of acamera module according to a fifth exemplary embodiment of the presentdisclosure and FIG. 10 is a plan view of a substrate of FIG. 9.

A substrate (300) of a camera module according to the fifth exemplaryembodiment of the present disclosure is mounted with an image sensor(310), a dam (320) is formed at an upper surface of the image sensor(310), and a dust trap (500) is formed from the dam (320) to a marginalarea at the upper surface of the image sensor (310).

The dust trap (500) is an adhesive material or an adhesive adheringforeign object (A) flowing or moving at the upper surface of the imagesensor (310). The image sensor (310) serves to convert an optical imageof an object through a lens to an electrical signal.

Referring to FIG. 10, the dust trap (500) cannot pollute an activeregion (a region capturing the optical image of the object) of the imagesensor (310) because of the dam (320). That is, the dust trap (500) hasa low viscosity and can flow into the active region of the image sensor(310), where the dam (320) can prevent the dust trap (500) from flowinginto the active region of the image sensor (310).

Thus, the present disclosure is advantageously configured in such amanner that the foreign object (A) is adhered by the dust trap formed atthe upper surface of the image sensor (310) to significantly reduce thedrop of the foreign object (A) to the image sensor (310), wherebygeneration of a black spot defect on the image sensor (310) caused bythe foreign object (A) can be reduced.

Furthermore, as shown in FIG. 10, the dam (320) may be formed in a shapeof a ring, where the shape of a ring includes a circular ring, a squarering and other shapes of a ring. The dam (320) may be formed at aperiphery of an active region of the image sensor (310). The dam (320)may be also formed at a position spaced apart from the periphery of theactive region of the image sensor (310) at a predetermined distance.

In this case, the formation of the dam (310) can prevent a dam materialfrom directly flowing into the active region of the image sensor (310).At this time, the dam (320) may be formed with a curable epoxy having ahigh viscosity. This is to prevent the dam from flowing to the maximumbefore curing at the time of forming the dam. The dam (320) may beformed with a low temperature curable epoxy, a thermosetting epoxy and aUV epoxy. Furthermore, the dam (320) may be formed by fixing a separatedam member to the image sensor (310) using an adhesive material.

FIG. 11 is a cross-sectional view illustrating a schematic structure ofa camera module according to a sixth exemplary embodiment of the presentdisclosure and FIG. 12 is a plan view of a substrate of FIG. 11.

A substrate (300) of a camera module according to the sixth exemplaryembodiment of the present disclosure is such that a dam (320) is formedat an upper surface of the image sensor (310), a dust trap (500) isformed from the dam (320) to a marginal area at the upper surface of theimage sensor (310), and a dust trap (510) is formed at an upper surfaceof the substrate (300) not mounted with the image sensor (310), as shownin FIG. 11.

Thus, as illustrated in FIG. 12, the camera module according to thesixth exemplary embodiment of the present disclosure is such that thedust traps (500, 510) are formed at the upper surface of the imagesensor (310) positioned at a periphery of the dam (320) and the uppersurface of the image sensor (310), whereby a foreign object can befurther trapped over the fifth exemplary embodiment of the presentdisclosure to reduce defects caused by the foreign object.

FIG. 13 is a cross-sectional view illustrating a schematic structure ofa camera module according to a seventh exemplary embodiment of thepresent disclosure.

A substrate (300) of a camera module according to the seventh exemplaryembodiment of the present disclosure is such that a dam (320) is formedat an upper surface of the image sensor (310), a dust trap (520) isformed from the dam (320) to a marginal area at the upper surface of theimage sensor (310), at an upper surface of the substrate (300) notmounted with the image sensor (310) and at a lateral surface of theimage sensor (310).

That is, the camera module according to the seventh exemplary embodimentof the present disclosure is such that the dust trap (520) is formed atthe upper surface and the lateral surface of the image sensor (310)positioned at a periphery of the dam (320), the upper surface of theimage sensor (310), whereby foreign objects formed on most of theexposed surfaces at the periphery of the dam (320) can be trapped by thedust trap (520), such that defects caused by the foreign objects can befurther reduced over the fifth and sixth exemplary embodiments of thepresent disclosure.

The dust traps formed on the substrates of the camera module accordingto the fifth, the sixth and seventh exemplary embodiments of the presentdisclosure may be applied with dust trap epoxy.

Thus, the present disclosure can form the dust trap (520) at the uppersurface of the image sensor (310) positioned at a periphery of the dam(320), and the upper surface of the substrate (300), to increaseformation of an area at an ambience of the image sensor (310) and totrap most of the foreign objects moving and flowing on the upper surfaceof the image sensor (310), whereby the drop of the foreign object to theactive region of the image sensor (310) can be prevented to reduce adefective image sensor (310).

FIG. 14 is a cross-sectional view illustrating a schematic structure ofa camera module according to an exemplary embodiment of the presentdisclosure, and FIG. 15 is a partial cross-sectional view illustrating aschematic structure of a camera module according to an exemplaryembodiment of the present disclosure.

Referring to FIG. 14, the camera module according to an exemplaryembodiment of the present disclosure may include a lens barrel (110)including one or more sheets of lenses receiving an optical image of anobject, an actuator (120) moving the lens barrel (110) and a holder(200) supporting the lens barrel (110) and the actuator (120), andattached to a substrate (300).

The actuator (120) moves the lens barrel along a direction to an opticalaxis for auto focusing. The actuator (120) may include one of a VCM(Voice Coil Motor) actuator, an actuator driven by a piezoelectric forceand a MEMS (Micro Electro Mechanical System) actuator driven byelectrostatic capacity method, where the VCM actuator may include abobbin, a coil, a magnet and a yoke.

In addition, the camera module according to an exemplary embodiment ofthe present disclosure may include a shake correction actuator (notshown in FIG. 14) capable of correcting shakes of an optical image of anobject. The shake correction actuator may be configured to correctshakes of an optical image of an object incident on the lens by moving aseparate lens optically aligned with a lens embedded in the lens barrelto 2-axes of X-axis and Y-axis.

Furthermore, as illustrated in FIG. 15, the holder (200) may be formedwith a window (210) passing an optical image incident on the lens. AnIRCF (600) may be interposed between the window (210) and an imagesensor (310). That is, the optical image having passed the window (210)is filtered of the IR by the IRCF (600) and incident on the image sensor(310), where the IRCF (600) may be attached to the holder (200).Furthermore, the IRCF (600) may be positioned between the lens and thewindow (210).

The above-mentioned camera module according to the present disclosuremay, however, be embodied in many different forms and should not beconstrued as limited to the embodiments set forth herein. Thus, it isintended that embodiments of the present disclosure may cover themodifications and variations of this disclosure provided they comewithin the scope of the appended claims and their equivalents.

While particular features or aspects may have been disclosed withrespect to several embodiments, such features or aspects may beselectively combined with one or more other features and/or aspects ofother embodiments as may be desired.

What is claimed is:
 1. A camera module, the camera module comprising: a PCB (Printed Circuit Board) mounted with an image sensor; a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor; an IRCF (Infrared Cut Filter) installed at an upper surface of the base; and an adhesive member fixing the IRCF to the base.
 2. The camera module of claim 1, wherein the adhesive agent includes an adhesive section adhering the IRCF to the base, and a foreign object collection section free from contact with the IRCF.
 3. The camera module of claim 1, wherein the adhesive agent is attached to a surface of a periphery of the window opposite to the IRCF.
 4. The camera module of claim 1, wherein the adhesive agent is arranged to be spaced apart from the periphery of the window at predetermined distance, and having a predetermined width.
 5. The camera module of claim 1, wherein the IRCF is formed to have an area greater than that of the window, and the adhesive agent is attached to a surface of a periphery of the window opposite to the IRCF to have an area greater than a contact area between the IRCF and the base.
 6. The camera module of claim 1, wherein the adhesive agent is adhesively fixed to a concave groove of the base so formed as to have a depth corresponding to a thickness of the adhesive agent.
 7. The camera module of claim 1, wherein the adhesive agent is adhesively fixed to a concave groove of the base so formed as to have a depth deeper than a depth corresponding to a thickness of the adhesive agent.
 8. The camera module of claim 1, wherein the adhesive agent is provided in any one of a double-sided tape and an epoxy to be fixedly arranged on an upper surface of the base.
 9. The camera module of claim 1, wherein the adhesive agent is adhesively fixed to a concave groove of the base so formed as to have a depth deeper than a depth corresponding to a thickness of the adhesive agent, and the concave groove is connected to an upper surface of the base through a slope to guide foreign objects at the upper surface of the base to the adhesive agent.
 10. A camera module, the camera module comprising: some exemplary embodiments, PCB (Printed Circuit Board) mounted with an image sensor; a base installed at an upper surface of the PCB and formed with a window at a position corresponding to that of the image sensor; an IRCF (Infrared Cut Filter) installed at an upper surface of the base; a dust trap resin cut rib protrusively formed at a periphery of the window opposite to the PCB; and a dust trap resin coated on a surface opposite the PCB of the base.
 11. The camera module of claim 10, wherein the dust trap resin cut rib is arranged at an upper surface of a non-image area of the image sensor.
 12. The camera module of claim 10, wherein the dust trap resin cut rib is arranged at an upper surface, being spaced apart at a predetermined distance from an image area of the image sensor.
 13. The camera module of claim 12, wherein the dust trap resin cut rib includes a chamfer at a surface opposite to a lateral wall of the base.
 14. The camera module of claim 10, wherein the dust trap resin is further coated on a surface opposite to an inner wall surface of the dust trap resin cut rib.
 15. The camera module of claim 1, further comprising: a bobbin including a coil winding unit vertically and reciprocally movable on the upper surface of the base and provided at a periphery, and a plurality of rib members protrusively formed on a floor surface; and a yoke mounted with a magnet arranged at a position corresponding to that of a coil of the bobbin, and the yoke is provided with a shield can of metal material having an EMI (Electromagnetic Interference) function to form an extreme outer shell of the camera module.
 16. The camera module of claim 15, wherein the yoke further includes a housing member formed in a resin material, and provided at an outer surface thereof with a shield can of metal material having the EMI function.
 17. The camera module of claim 15, wherein the outer surface of the yoke forms an extreme outer shell of the camera module, and a balance surface of the yoke integrally forms the housing member to allow being on a same surface as the outer surface of the yoke.
 18. A camera module, the camera module comprising: one or more sheets of lenses receiving an optical image of an object; an image sensor converting the optical image of the object from a lens to an electrical signal, formed at an upper surface with a dam, and formed at an upper marginal area of the image sensor with a dust trap from the dam; and a substrate mounted with the image sensor.
 19. The camera module of claim 18, wherein the dam is provided with a shape of a ring, and formed at any one of a periphery of an active region and a position spaced apart from the active region.
 20. The camera module of claim 18, wherein the dust trap is provided in any one of epoxy and an adhesive agent, and extensively formed to an upper surface of the substrate not mounted with the image sensor.
 21. The camera module of claim 18, wherein the dust trap is further formed at a lateral surface of the image sensor.
 22. The camera module of claim 21, wherein the dam is formed at an upper surface of the image sensor using any one of a curable epoxy and a separate dam member. 